Diamond saw wire cutting machine

The diamond saw wire cutting machine adopts a unidirectional or reciprocating movement of the diamond wire to form a relative grinding movement between the diamond saw wire and the object to be cut, to achieve the purpose of cutting. It is mainly used for cutting granite, marble, housing construction, bridges, subways, underwater buildings, etc. It is also used in ceramics, glass, rocks, gems, jade, meteorites, etc.

Here is the content list:

• Brief introduction of diamond wire cutting machine.

• The working principle of diamond wire cutting machine.

• Application examples of diamond saw wire.

Brief introduction of diamond wire cutting machine

When the processed material is not conductive and the wire cutting method is required, the wire EDM will lose its effect. For this reason, the diamond wire saw will begin to show its processing advantages. It can be used for conductive and non-conductive materials (as long as the hardness Smaller than diamond saw wire) for cutting. Therefore, diamond wire sawing machines are widely used to cut various metal and non-metal composite materials, such as ceramics, glass, rocks, gems, jade, meteorites, monocrystalline silicon, silicon carbide, polycrystalline silicon, refractory bricks, epoxy plates, iron Oxygen bodies, PCBs, building materials, dental materials, biological and bionic composite materials, etc., are especially suitable for cutting various brittle crystals with high hardness, high value, and fragility.

The working principle of diamond wire cutting machine

The cutting principle of the diamond saw wire cutting machine is similar to that of a bow saw. The high-speed rotating and reciprocating wire winding drum drive the diamond saw wire to reciprocate. The diamond saw wire is tensioned by two tensioning wheels (spring or pneumatic). At the same time, two guide wheels are added to ensure the accuracy and surface of the cutting. type. By automatically controlling the worktable to continuously feed in the direction of the diamond saw wire console, or control the diamond saw wire console to continuously feed in the direction of the worktable so that the diamond saw wire and the object to be cut are ground to form a cut. During the cutting process, due to the small diameter and elasticity of the diamond saw wire, the diamond saw wire forms an opening angle between the object to be cut and the two guide wheels on its left and right, and the diamond wire is in the shape of a slight arc. Therefore, the force applied to the object to be cut is combined with the relative movement between the diamond saw wire and the object to be cut, so that the cutting can continue.

Application examples of diamond saw wire

Silicon carbide (SiC) is a third-generation semiconductor material. It has the advantages of a large bandgap, high critical breakdown field strength, and high thermal conductivity. It is an ideal material for making high-voltage, high-power semiconductor devices. Although it is extremely important to growing high-quality large-diameter SiC single crystals, wafer processing plays a decisive role in the surface quality of the wafers. Among them, it is very important to cut bulk single crystals into wafers with small warpage, uniform thickness, and small knife gap loss. Important, otherwise it will bring great difficulties to the subsequent grinding and polishing work. Since the Mohs hardness of SiC is 9.2, second only to diamond (its Mohs hardness is 10), the processing is very difficult. When the diameter of the crystal reaches 2 inches, the conventional inner circle cutting machine cannot work effectively, and the diamond saw wire cutting technology must be used.

At last

The diamond saw wire produced by our company has been selling well for many years. Welcome to visit our company's official website for detailed information.