Views: 0 Author: Site Editor Publish Time: 2021-11-29 Origin: Site
The application of diamond segment size to sapphire cutting began in 2007, while the cutting of crystal silicon wafer only began in 2010. Because the purity of a single crystal silicon rod is higher and the physical properties of the material are higher, it is more beneficial to cut a thin silicon wafer.
Wear degree of diamond segment for granite
Hardness of diamond segment for granite
Material selection elements of diamond segment for granite
The wear of diamond milling cutter increases obviously with the increase of cutting depth. Under the condition of small feed, the wear of the milling cutter is 4 times higher than that of machined marble. With the increase of cutting depth, the wear of machined diamond segment for granite milling cutter is 1 ≤ 2 orders of magnitude higher than that of machined marble. The hardness of granite is higher than that of marble, and the hardness of stone has a great influence on the wear of diamond milling cutter. With the increase of cutting depth, the surface temperature of milling cutter increases, which leads to a sharp increase in the wear of the diamond milling cutter.
When processing marble, the wear rate decreases with the exclusive increase of milling cutter, but the influence of rotating speed on wear is not very great. When the special speed of the milling cutter increases, the milling force decreases, while when the cutting depth and feed speed increase, the milling force increases. The increase of milling force may lead to the breakage of diamond and serious wear of matrix, and diamond falls off from the matrix. When granite is processed, the wear rate decreases with the increase of milling cutter speed, and when the rotating speed reaches above 4000r/min, the wear amount begins. At the same time, the average wear is five times higher than that of marble. From the average amount of wear, the cutting depth has a great influence on the wear, followed by the feed speed, and finally the speed of the milling cutter. When machining granite, the average wear of milling cutter is about 10 times of that of marble, so it can be seen that the hardness of stone also has a great influence on the wear of diamond milling cutter, and the wear amount increases obviously with the increase of hardness.
Good motor is also the key to graphite cutting line, ring carborundum cutting line, ring wire saw, closed diamond wire saw, ring diamond wire saw, ring wire saw, ring wire saw, stable long-term use. When the speed of the motor is uneven, it is also easy to break the line. Broken wire is a headache in the use of circular wire saws. In order to alleviate this problem, element tools have done a lot of research on the use of circular wire saws in order to work with users to reduce the broken line rate.
From the practical application, the cutting technology of silicon wafer has hardly changed in the past ten years. Reducing costs, improving production efficiency and controlling the damage of silicon carbide to the environment have become the bottleneck restricting the development of the photovoltaic industry.
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